按一下以編輯母片,第二層,第三層,第四層,第五層,ISO14001教程,*,1,1.,简,介,1.1,微切片作用,1.2,微切片分,类,1.3,微切片制作流程,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,11.简介1.1 微切片作用具体流程 1 简,2,1.1,微切片作用,微切片,:,是,观,察,PCB,內部,结,构狀,况,及內部,数据,据,测量,的一种工具,能有力,帮,助,现场发现问题,解,决问题,.,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,21.1 微切片作用 微切片:是观察PCB內部结,3,1.2,微切片分,类,微切片可分为垂直切片、水平切片、斜切片及微切片。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,31.2 微切片分类微切片可分为垂直切片、水平切片、斜切片,4,1.3,微切片制作流程,取,样,灌,胶,研磨,拋光,微,蚀,判,读,具,休,流程,1,简,介,2,取樣,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,41.3 微切片制作流程取样灌胶研磨拋光微蚀判读具休流程,5,2.,取,样,成品取,样,:,直接,冲,取,最小的过电孔孔数需达到三个或三个以上，优先选则,BGA,和密集孔位置,.,注意事,项,:,在,冲,取切片,时,将,待,观察,的孔放置于,冲,床凹,槽的正中,间,位置,以保,证,待,观,察孔的完整性,.,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,52.取样 成品取样:直接冲取最小的过电孔孔数需达,6,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,2.,取樣,切片,冲,床,冲,取好的,样片,ISO14001教程,6具体流程 1 简介 2 取样 3,7,3.,灌,胶,灌胶目的:用样板夹夹紧切片试样减少变形，将通孔灌满胶，使其在研磨过程中其铜层不致被拖拉延伸而失真。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,73.灌胶灌胶目的:用样板夹夹紧切片试样减少变形，,8,3.,灌,胶,灌胶的做法有很多种,现列举行业内在用的三种:,3.1,AB,胶 +树脂,3.2 压克力粉 +固化剂,3.3 水晶胶 +固化剂,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,83.灌胶灌胶的做法有很多种,现列举行业内在用的三种:,9,3.,灌,胶,金相胶粉 +固化剂,金相胶粉与固化剂的配比为,3:1,调匀后灌入模具内，,3,5,分钟后即可固化研磨。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,93.灌胶 金相胶粉 +固化剂,10,4.,研磨,研磨用双盘研磨机加上不同目数的砂纸将样品研磨至,孔的中,间,橫截面,处,。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,104.研磨 研磨用双盘研磨机加上不同,11,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,4.,研磨,双盘研磨机,研磨,时冲,水,各种型号的砂纸,ISO14001教程,11具体流程 1 简介 2 取样,12,5.,拋光,在抛光布上,加入,抛光粉并用水稀释，将转速调至,150200,转,/,分,将,切片,轻,微接,触,拋光,布,不,断转换方向,直到砂痕消失切面光亮,为,止。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,7,判,读,6,微蚀,ISO14001教程,125.拋光 在抛光布上加入抛光粉并用水稀释，将,13,5.,拋光,拋光粉,拋光,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,135.拋光拋光粉拋光具体流程 1 简介,14,6.,微,蚀,微,蚀,前,微,蚀,后,微蚀的作用是:分出金属之各层面与其结晶状况,效果,不好时抛掉不良铜面重做微蚀,。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,146.微蚀微蚀前微蚀后微蚀的作用是:分出金属之各层面,15,6.,微,蚀,微,蚀,液的配方是,:“,氨水,+,水,+,双氧水,”,配比为：,1,：,1,：,0.1,观察,面上,滴,微,蚀,液用棉花棒擦抹后,铜,面,产,生微小,气,泡,即表示反,应,已在,进,行,来,回擦,蚀约,13,秒,钟,立刻用,口罩擦干,勿使,铜,面,继续,氧化,变,色,.,良好的微,蚀将,呈,现鲜红铜,色,且,结,晶分界清楚。,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,156.微蚀微蚀液的配方是:“氨水+水+双氧水”具,16,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,6.,微,蚀,微,蚀,液,微,蚀,ISO14001教程,16具体流程 1 简介 2 取样,17,7.,判读,观察,及,测量,用的金相,显,微,镜,量,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,177.判读观察及测量用的金相显微镜量具体流程 1,18,7.1,龟,裂,Crack IPC-A-600F-3.3.53.3.6,允收,-,孔壁及,转角均无,裂痕,拒收,-,镀铜层,均有裂痕,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,187.1 龟裂 Crack IPC-A-600F-,19,7.2,芯吸,Wicking IPC-A-600F-3.3.11,允收,芯吸,4mil,拒收,:,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,197.2 芯吸 Wicking IPC-A-600F,20,7.3,胶,渣,Smear IPC-A-600H-3.3.12.3.3.13,垂直切片,水平切片,允收,拒收,拒收,允收,拒收,拒收,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,207.3 胶渣 Smear IPC-A-600H-3.,21,7.4,孔壁粗糙度,Roughness,允收,拒收,:,粗糙度,1mil,:,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,217.4 孔壁粗糙度 Roughness 允收 拒收,22,7.5,结,瘤,Nodules IPC-A-600H-3.3.7,允收,拒收,:,影响到孔径,:,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,227.5 结瘤 Nodules IPC-A-600H,23,7.6,树,脂內,缩,Resin Recession IPC-A-600F-3.1.8,热应,力后的,树脂内缩,均,为,允收,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,237.6 树脂內缩 Resin Recession IPC,24,7.7,电镀,空洞,Plating Void IPC-A-600F-3.3.9,允收,拒收,:,镀层空洞超过一个,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,247.7 电镀空洞 Plating Void IPC-,25,7.8,镀层分离,Pullaway,允收,拒收,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,257.8 镀层分离 Pullaway 允收 拒收具体,26,7.9,玻璃,纤维,突出,Class Fiber Protrusion,允收,拒收,:,影响到孔径,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,267.9 玻璃纤维突出Class Fiber Protr,27,7.10,銅厚,Copper thickness,孔內,铜,厚,:(AF),基板,铜,厚,:G,电镀铜,厚,:H,表面,铜,厚,:I,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,277.10 銅厚 Copper thickness 孔內,28,7.11,钉头,Nail Heading IPC-A-600H-3.4.2,钉头,1.5,倍,铜,箔厚度,可接受,钉头,1.5,倍,铜,箔厚度拒,受,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,287.11 钉头 Nail Heading IPC-A,29,7.12,层压,板空洞,Laminate Void IPC-A-600F-3.1.1,允收,:,空洞小于或等于,3mil,且不,违,反介,质间,距的,规,定,拒收,:,超,过过,以上,规,定,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,297.12 层压板空洞 Laminate Void,30,7.13,阻焊,厚度,S/M Thickness,基材上,线,路上,线,路拐角,处,按客户要求测量以下几点,:,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,307.13 阻焊厚度 S/M Thickness 基材上,31,7.14,介质层,厚度,Dielectric Thickness IPC-A-600F-3.1.7,L3,L4,L2,L3,L1,L2,依客,户规定,管制,.,如客,户,无规定，,必,须,3.5mil,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4,研磨,5,拋光,6,微,蚀,7,判,读,ISO14001教程,317.14 介质层厚度 Dielectric Thickn,32,7.15,蚀,刻因子,Etch Factor IPC-A-600F-3.2.1,具,体,流程,1,简,介,2,取,样,3,灌,胶,微切片,制,作,与检验,4