,6/16/2021,#,后疫情时代的终端与材料新趋势,后疫情时代的终端与材料新趋势,1,后疫情新时代,笔记本演进 新材料需求,后疫情新时代,2,3,3,3,后疫情时代的终端与材料新趋势课件,4,PC,Smart,Car,Smart,Phone,后疫情时代的终端与材料新趋势课件,5,全球,P,C,市场预测,全球PC市场预测,6,Chrome,Book,市场预测,Chrome Book 市场预测,7,Chrome Book,Trend,Omdi,a,：,2021,年,Q,1,全球,C,h,rom,e,b,o,o,k,出货量达到,1,0,9,3,万台 同比增长,369%,Chrome,Book,市场预测,Chrome Book TrendOmdia：2021年Q1,8,2000,Thinkpad,A30,Plastic,14”,45mm,3.4,Kg,PowerBook,G4,AL,alloy,15”,28mm,2.5,Kg,2,0,12,Thinkpad,Z61t,Ti alloy,+,plastic,14”,26mm,2.47,Kg,2006,2,0,11,Carbon fiber,+,Mg-AL,14”,18.8mm,1.36,Kg,795,g,2,0,14,NEC,Lavie,Z,Thinkpad X1 carbon,Mg-Li,+,Mg-AL,13.3”,14.9mm,2020,Lifebook,UH-X,Carbon,+,Mg-Li,13.3”,15.5mm,634,g,2003,Thinkpad,X1,Mg-AL,13.3”,21mm,1.7,Kg,1992,Thinkpad,700C,Plastic,10.5,“,48mm,2.95,Kg,Pla,s,tic,M,e,t,al,Light,Metal,Ultra,Light,笔记本演进与材质,2000Thinkpad A30PowerBook G420,9,笔记本分类场景化,0,2,0,6,0,1,常规本,便携本,轻薄本,游戏本,二合一,折迭本,笔记本分类场景化020601常规本便携本轻薄本游戏本二合一折,10,11,Foldable,Phone 5G Moto,Razr,11Foldable Phone 5G Moto Razr,11,12,World,1,st,Foldable,PC,-,5G,Foldable,PC ThinkPad X1,Fold,12World 1st Foldable PC-5GFo,12,后疫情时代的终端与材料新趋势课件,13,14,14,1414,14,超轻,Ultra,Light,Material,+,Metallic,Looking,MgLi,for ultra,light,Nano,3D,texture,print,for,CMF,Health,protection,Antiviral treatment,on plastic/glass/metal,健康,New,Material,for,Thin,Light,Health,High Stiffness,for,Thin,Device,Liquid,metal,超强,后疫情新材料,15,AL6,0,61,Liquid,metal w/o,deform,超轻Health protectionAntiviral t,15,超轻材料,超轻材料,16,.,V,i,r,u,s,Antiviral,Compound,React,Active oxide,Metal,ion forms reaction,with,H2O/O2 to generate,HO,HO will inactive bacterial,and,virus,Antiviral:,greatly reduced active,viruses,Antiviral,Principle,抗病毒材料,.VirusAntiviral CompoundReactA,17,种类,金属,其他,特性,不锈钢,铝合金,铝合金,钛合金,镁合金,镁合金,锌合金,非晶,(ZFB),Mg-Li,Glass,Sapphire,Ceramic,Carbon,Fiber,PC,SUS304,6061-T6,5052,6Al4V,AZ91D,AZ31B,ZnAl4,Corilla,ZrO2,拉伸强度,(MPa),645,310,205,895,230,290,315,1500,200,2500,屈服强度,(MPa),285,276,105,825,160,220,276,/,160,863,690,1000,1300,104,E,弹性系数,(Gpa),193,69,73.2,250,45,45,84.3,93,44,65.8,470,200,150,6.7,比强度,80,115,76,197,127,163,46,221,147,1515,密度,(g/cm3),8.03,2.7,2.7,4.54,1.81,1.78,6.8,6.8,1.36,2.44,3.97,6,1.65,1.23,硬,度,(,维氏,),200,107,68,349,140,60,85,450,66,550,2200,1200,热传导,系,数,(W/Km),16.3,167,137,7.1,78,96,105,2.9,44,1,41,3,0.2,材质特性表,种类金属其他特性不锈钢铝合金铝合金钛合金镁合金镁合金锌合金非,18,3,0,0,2,5,0,2,0,0,1,5,0,1,0,0,50,0,E,弹性系数,(G,p,a),9,8,7,6,5,4,3,2,1,0,密度,(g/cm3),1,4,00,1,2,00,1,0,00,8,0,0,6,0,0,4,0,0,2,0,0,0,硬度,(,维氏,),4,0,0,3,5,0,3,0,0,2,5,0,2,0,0,1,5,0,1,0,0,50,0,不锈钢铝合金铝合金钛合金镁合金镁合金锌合金非晶,(ZF,B,),N,i,v,a,f,l,e,x 45/18,比强度,300E弹性系数(Gpa)9密度(g/cm3)1400硬度(,19,滤波器材料,金属滤波器,微波陶瓷滤,波器,PCB,关键材料,铜箔基板,高频基材,半导体材料,G,a,N,s,S,iC,/G,aN,天线材料,PI,L,C,P/,M,PI,外壳材料,金属,/,玻璃,/,塑料,玻璃,/UTG/,复合材料,/,低 介电材,/CPI,导热散热材料,石墨片,/,散热 鳍片,/,风扇,石墨烯,/,液冷 热管,/,相变材 料,Arion/Rogers/,松 下電工,/,三菱瓦斯,/,日立化成,/,旭化成,/,東芝,/GE,赛拉尼斯,/,索尔维,/,宝理,/,住友化,学,/,三 菱化学,/,东丽,/,可乐 丽,/,世洋,康宁,/AGC/,肖特,/,三菱,/Sabic/,索尔 维,/,威格斯,/,赢创,/,科 慕,/,塞拉尼斯,/,杜邦,/,全球主要厂商,4G/5G,消费电子材料转变,大韩化工,/,东丽,全球,5G,手机出货占比,:,30%,(2020),80%,(2021),。,中國,5G,手机出货量,占,比,68.4%,(2020/12),。,滤波器材料金属滤波器微波陶瓷滤PCB关键材料铜箔基板高频基材,20,21,材,料,DK/DF,表,材料,Dk(,介电常,数,),Df(,介电损耗,),真空,1,Air,1.000585,Teflon(PTEF),2.0-2.1,0.0004,LCP,3,0.002,PC,3,0.005,MPI,3.2,0.005,环氧树脂,34,0.004,PI,3.84.2,0.008,Glass,47,0.02,陶瓷,68.5,0.0001,Patch array,peak,realized gain,(dB),V-pol,Patch array,peak,realized gain,(dB),H-pol,28GHz,39GHz,28GHz,39GHz,Free,Space,10.33,dB,11.93,dB,10.25,dB,12.17,dB,Plastic,housing,10.1,dB,11.9,dB,9.7,dB,11.1,dB,Glass,housing,9.3,dB,11.0,dB,7.9,dB,9.2,dB,21材料 DK/DF 表材料Dk(介电常数)Df(介电损耗),21,