单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,目 录,激光,LASER,简介,机器特性及应用,ESI UV Laser,5330,激光简介,-,类别,Laser,常用的有,CO2,UV,两种厂家,生产,UV,的厂家有,:ESI,Siemens,LPKF,生产,CO2,的有,:,Lumonics,Hitachi,Sumitomo,Mitsubishi,我们公司用的是,ESI UV 5330,各种光线的区分,一般光可分为：,红色,橘色,黄色,绿色,青色,蓝色,紫色,波长：,0.76um-0.38um,红外线的波长：,0.75um1mm,UV:,紫外线的波长,0.18um0.4um,激光对物体的反应,激光,部分被反射,部分被吸收,部分穿透,FR4,Cu,Glass,对光的吸收,波长,(,m),Total Absorption,UV,Visible,FR4,Cu,Glass,Courtesy of ESI,IR,机器特性及应用,光的直径,:25-50um,25um,50um,Z=+2 mm,Z=-2 mm,Z=0 mm,激光切割的方式,Punch,Spiral Trepan Circle Adv spiral,See next page,ADv,Spiral,LASER,在盲孔中的运用,LASER,盲孔一般分两个步骤,:,两步,Spiral,1.,把面铜割开,并去除部分,PI,或胶,2.,用低能量将剩余部分胶去除,.,Raw Material,Copper,Copper,Kapton,Adhesive,2,nd,Step Laser Ablation,1,st,Step Laser Ablation,盲孔形成的整个过程,过程,:,F/A Inspection,Plasma Desmear,Shadow Metalization (F/A Required),Electro-Copper Plating(Agitation+Vibration,Micro etch,AOI Scan for“Black Hole”,盲孔经,SHADOW,处理后,Shadow,后正常,镀铜后,热冲击测试,Shadow,异常或胶残留,镀铜后,热冲击测试,盲孔镀铜后的切片,有胶铜和无胶铜,0.004”blind via after laser,LASER,一般钻孔,步骤,:,F/A Inspection,Raw Material,Copper,Copper,Kapton,Kapton,Adhesive,Plasma desmear&Microetch,Shadow Metalization (F/A Required),Laser Ablation,Electro-Copper Plating,通孔镀铜后切片,通孔,:,Spectra,0.003”,Interconn,0.004”,4 Layers Adhesive Base,0.004”,Adhesiveless Base,0.002”,Spectra,0.003”,Motorola 199&572,0.004”,LASER,基准点,一个,SUB-PANEL,ESI LASER,最多可以设置,4,个基准点,Group-Fiducial,Part Alignment Capability,X-Y Offset,Rotation,Symmetrical Scaling,Asymmetrical Scaling,1,Yes,2,Yes,Yes,3,Yes,Yes,Yes,4,Yes,Yes,Yes,Yes,Group,Pattern,Group Pattern,Group Pattern,Group Pattern,一般基准点设置及式样,不是所有的板子都必须设置,4,个基准点,这应该根据板子收缩、精度等要求设置,因为基准点设置越多,机器抓的总点数就多,这样就浪费很多抓点时间,影响生产效率,一般板子一个,SUB-PANEL,设置两个,例如,:,基准点设置,压好,base,的板钻孔,一般整张设置两个,这样有利于底片的对位,提高效率,不用剪小底片,.,例如,:,基准点设置,对于尺寸要求高的,一般设置,4,个,例如有,ZIF,尺寸要求的,:,B Distance of outline to ZIF,A Width of ZIF outline,Outline,基准点式样,最常见的基准点及要求,1.,中心点的直径要小于,15MIL,2.,中心和边缘要有明显的视觉差别,如下几种常见的基准点,:,检验底片的制作,一般钻孔的底片,孔做成圆环,两者比对后的图形,底片上的圆环,铜钻过孔后形成的图形,底片的制作,一般保护膜和外形的底片,直接把外形和孔做出就可以,.,LASER,程序,Laser,程序制作,设计,CAD(dxf,文件,)ESI CAM,转化,laser,程序,*,bas,文件 *,900,文件,包含,1.Drill,和,rout,的命令,2.,基准点坐标,3.,钻孔和外形坐标,一个基准块,包含,1.,重复*,bas,文件的基准块,2.,以及基准点,程序调试,将设计制作好的,laser,程序,(*bas,和*,900,文件,),拷贝到机器里,并设定参数文件,(*td,文件,),组合成*,app,文件,.,整个程序制作完成,.,ESI Laser Application,File type,Extension,Recommendations,Remark,Application,.app,Stores the laser system parameters and defines which TP and TD file used,Toolpath,.,tp,or.bas*.900,Hole location;hole sizes;alignment points,.900,for step and repeat,Tooldef,.td,Drill tool parameters,.,Toolpath,Functions,%,defines the beginning and defines the end of TP file,T1 x,defines a tool type for all subsequently defined tool number.,1 drill tool,8 compound tool(for alignment and S/R),6 profile tool,T0 x,defines the tool number,1-899 parameter,900-989 S/R tools,993 coarse alignment,994 chuck alignment location,995 996-999 990 M2 pause,T2 x,defines a tool diameter,G0 rapid move,G1 profile move,G2 clockwise arc,G3 counterclockwise arc,P0 start cutting,P1 end cutting,I center of arc(x),J center of arc(Y),X X coordinate,Y Y coordinate,Program Command,