,CMO Confidential,按一下以編輯母片,第二層,第三層,第四層,第五層,按一下以編輯母片標題樣式,CF Process,簡介,Jerry,TFT/LCD,材料工程部,CF Process簡介Jerry,LCD&CF,結構簡介,CF,光阻材料簡介,CF,製程及檢驗手法簡介,Macro Inspection,判定方法,Micro Inspection,判定方法,CF Product ID naming rule,課程大綱,LCD&CF結構簡介課程大綱,LCD,面板 結構圖,下玻璃基板,上玻璃基板,上偏光板,PS,液晶分子,下偏光板,框膠,配向膜,TFT,元件,彩色濾光板,液晶層,光線,(,背光源,),LCD:,L,iquid,C,rystal,D,isplay(,液晶顯示器,),LCD面板 結構圖下玻璃基板上玻璃基板上偏光板PS液晶分子下,CF,結構圖,ITO,剖,面,示,意,圖,俯,視,示,意,圖,實際圖例,素玻璃,BM,R,Layer,G,B,MVA,PS,CF:,C,olor,F,ilter(,彩色濾光片,),CF 結構圖ITO剖俯實際圖例素玻璃BMR L,光阻材料分類與成分,正型光阻,:,BM(Cr),MVA,負型光阻,:,Color Resist(,R,G,B,),PS,RBM,彩色光阻,溶劑,固成分,Paste,Polymer,Monomer,Photo-initiator,Additive,Pigment,Dispersant,Solvent,Monomer,Initiator,光阻材料分類與成分正型光阻:BM(Cr),MVA彩色光,光阻材料成分,v.s,光阻特性,光阻材料成分 v.s 光阻特性,CF,製造流程,1.,廣視角產品,(MVA,產品,),:,2.,非廣視角產品,(TN,產品,),:,BM,R,G,B,ITO,PS,BM,R,G,B,ITO,MVA,PS,*BM,依材質類型有,Resin,及,Cr BM,二種,CF 製造流程1.廣視角產品(MVA產品):2.非廣視角產品,CF,製作方法,CF 製作方法,CF,製程機制,:,Photolithography,Photosensitive Materials,Substrate,Negative Type,Positive Type,MM,Binder,UV,Pigment,Photo-initiator,Soluble,Insoluble,Coating,Exposure,Development,Images,UV,Photolithography,:,顯影液,:KOH,CF 製程機制:PhotolithographyPhoto,CF Process,優點,:,1.Process,減少,(,設備簡化,),2.,光阻用量減少,(1)Spin,-,轉速,(rpm),決定膜厚,(2)Spinless,-,吐出量,(PR,值,),決定膜厚,Coater,Spin,VCD,EBR,HP/CP,Exposure,Development,AOI,Oven,Cassette,Coater,VCD,HP/CP,Exposure,Development,AOI,Oven,Cassette,Coater:,優點,:,塗佈均勻性較好,缺點：,1.,多一道製程,2.,光阻用量多,(,浪費光阻,增加成本,),CF Process優點:1.Process減少(設,BM Process(1300),BM:,遮蔽漏光區,增加對比,RGB:,提供色度,ITO:,提供電場所需之電極,MVA/DJ ITO:,提供廣視角,PS:,支撐,TFT/CF,所需之,Cell Gap,BM Process(1300)BM:遮蔽漏光區,BM Process,鉻玻璃清洗,正光阻塗佈,(1),正光阻塗佈,(2),Pre-cleaner,Slit coater,Spin coater,2.BM photo line,Unpacker&Initial cleaner,鉻膜濺鍍,素玻璃投入,1.Cr sputtering,鉻玻璃,Cr sputter,Cr glass,CrOx,CrNy,Cr,一,.Cr BM process:,X,X,:,Spinless,無,BM Process鉻玻璃清洗正光阻塗佈(1)正光阻塗佈(,BM Process,蝕刻,去光阻,紫外線曝光,顯影,烘烤,(Oven),去掉邊緣光阻,EBR(Edge Bead Rinse),Aligner,Developer,Hot plate,3.Etching line,Etching,Stripping,BM pattern glass,真空乾燥,Vacuum Dryer,Pre-bake&Cool plate,X,X,:,Spinless,無,預烘烤,(HP),與冷卻,(CP),BM Process蝕刻去光阻紫外線曝光顯影烘烤(Oven,BM Process,二,.RBM process:,素玻璃清洗,負光阻塗佈,(1),負光阻塗佈,(2),Pre-cleaner,Slit coater,Spin coater,X,X,:,Spinless,無,紫外線曝光,顯影,烘烤,(Oven),去掉邊緣光阻,EBR(Edge Bead Rinse),Aligner,Developer,Hot plate,真空乾燥,Vacuum Dryer,Pre-bake&Cool plate,X,預烘烤,(HP),與冷卻,(CP),BM Process二.RBM process:素玻璃,環保意識,降低設備及建廠成本,(,省掉,sputtering,及,Etching,的設備,),簡化製程流程,製程一致性,(BM,RGB,PS,均使用負光阻,),RBM,的優點,環保意識RBM 的優點,Black matrix,的功用,遮蔽,TFT,避免,pixel,以外區域漏光,增進色彩對比性,降低面板的反射光,Black matrix,的需求,低反射率,:,減低外來光線的干擾,高,OD,值,:,阻隔,pixel,間的,背光,(,增高對比,),膜厚薄,(,避免角斷差發生,),低,pinhole,數,:,避免漏光,產生亮點,低,particle,數,:,增加良率,Black matrix 的功用遮蔽TFTBlack ma,BM Inspection,1,2,3,1.Total Pitch(,長寸法,)2.CD(Critical Dimension)3.Mark to Edge(,端寸法,),Substrate,R,1.,OD=-log(I/Io)4,2.,反射率,(Cr BM),3.,Thickness(Resin BM),顯影後缺陷檢查,ADI(After Developer Inspection),巨觀檢查,(Macro review),Io,I,BM Inspection1231.Total Pitch,ILSP01:OD,Start,區,&,平坦區各,1,點,片片檢,避免,Start,區,&,平坦區的,OD,值差異太大,.,MUIN01:Macro,確認,In-line Macro,品質狀況,(,有無,mura),PRIN01:AOI,CD,確認,In-line Micro,品質狀況,避免,CD,太低,造成,LCD,漏光,RBM Layer In-line Sampling,ILSP01:ODRBM Layer In-line Sa,RBM Layer off-line Sampling,SPME01:OD,避免,OD,太低,造成,LCD,漏光,MACR51:Macro,確認,BM off-line Macro,品質狀況,CDME01:CD,端寸,Total pitch,避免,CD,太低,造成,LCD,漏光,避免,T/P,太大,or,太小,造成,LCD,對組後漏光,SUFT01:BM Thickness,控制角段差及,OD,RBM Layer off-line SamplingSPM,R,G,B,Process(,2300,3300,4300,),BM:,遮蔽漏光區,增加對比,R,G,B,:,提供色度,ITO:,提供電場所需之電極,MVA/DJ ITO:,提供廣視角,PS:,支撐,TFT/CF,所需之,Cell Gap,RGB Process(2300,3300,4300,R,G,B,Process-,R,-Layer,紅色光阻塗佈,(1),紅色光阻塗佈,(2),Pre-cleaner,Slit coater,Spin coater,BM pattern glass,清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(Edge Bead Rinse),Aligner,Developer,烘烤,Oven,真空乾燥,Vacuum Dryer,預烘烤,(HP),與冷卻,(CP),Pre-bake&Cool plate,X,X,X,:,Spinless,無,RGB Process-R-Layer紅色光阻塗佈(,R,G,B,Process-,G,-Layer,綠色光阻塗佈,(1),綠色光阻塗佈,(2),Pre-cleaner,Slit coater,Spin coater,R glass,清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(Edge Bead Rinse),Aligner,Developer,烘烤,Oven,真空乾燥,Vacuum Dryer,Pre-bake&Cool plate,X,X,預烘烤,(HP),與冷卻,(CP),X,:,Spinless,無,RGB Process-G-Layer綠色光阻塗佈(,R,G,B,Process-,B,-Layer,藍色光阻塗佈,(1),藍色光阻塗佈,(2),Pre-cleaner,Slit coater,Spin coater,R,G glass,清洗,紫外線曝光,顯影,去掉邊緣光阻,EBR(Edge Bead Rinse),Aligner,Developer,烘烤,Oven,真空乾燥,Vacuum Dryer,Pre-bake&Cool plate,X,X,預烘烤,(HP),與冷卻,(CP),X,:,Spinless,無,RGB Process-B-Layer藍色光阻塗佈(,1,2,1.Pixel CD2.Overlay3.,厚度,(RGB,段差,),4.RGB,色度量測,3,R,G,B,Inspection,121.Pixel CD2.Overlay3.厚度,ITO Process(5200),BM:,遮蔽漏光區,增加對比,RGB:,提供色度,ITO:,提供電場所需之電極,MVA/DJ ITO:,提供廣視角,PS:,支撐,TFT/CF,所需之,Cell Gap,ITO Process(5200)BM:遮蔽漏光區,What is ITO?,ITO =,I,ndium,T,in,O,xide(,銦錫氧化物,),90 wt.%In,2,O,3,+10 wt.%SnO,2,What is ITO?ITO =Indium Tin,Sputtering(,濺鍍,),的原理,於真空環境下,通入高電壓及,Ar/O2,混合氣體,產生,Ar+,離子撞擊,ITO,靶材,形成銦錫離子與,O,離子反應成銦錫氧化物,(ITO),濺鍍於產品上,.,Vacuum,Chamber,Substrate,Target,Plasma,Ar,+,e,-,Gas Inlet,Vacuum Pumps,-2kV,Sputtering(濺鍍)的原理於真空環境下,通入高電,ITO sputtering process,氧化銦錫膜濺鍍,ITO sputter,ITO pre-cleaner (,水洗,清洗無機物,),R,G,B,玻璃投入,ITO,玻璃,ITO glass,Defect Inspection(,缺陷檢查機,),(Micro 1,4560),UV asher(,清洗有機物,),紫外線灰化,Repair(,修補,),(repair 1,4578),ITO sput